PCB Design Engineer

Flex Power Modules is looking for a committed PCB Design Engineer to join our R&D team in Kalmar.

In this role, you will help develop the next generation of power solutions for cloud services, AI and data centre infrastructure, with a focus on advanced DC/DC conversion and power electronics.

You will be part of our PCB design team, supporting the product development organisation in creating high-performance PCB solutions. PCB development is an iterative process in which close collaboration between electronics, mechanical and simulation engineers is essential to achieving an optimal balance between electrical performance, thermal management and manufacturability.

As part of our agile and collaborative development environment, you will have the opportunity to influence both product development and our design methods. We continuously explore new PCB technologies and methods to meet the challenges of increasing power levels, higher current densities and growing product complexity.

Main duties
Design multilayer PCBs for advanced power conversion products.
Work closely with electronics, mechanical and simulation engineers throughout the product development cycle.
Optimise PCB layouts in terms of electrical performance, thermal management and manufacturability.
Develop and maintain component footprints and PCB design libraries.
Contribute to the development and improvement of design rules, best practices and working methods.
Take part in evaluating new technologies and contribute to the introduction of new PCB design methods and manufacturing techniques.

Qualifications
University degree in electronics engineering or equivalent practical experience.
Good experience in PCB design.
Experience with Cadence Allegro PCB Designer.
Strong collaboration and communication skills, with experience of working in cross-functional development teams.
Fluent in spoken and written English.

Desirable experience
Design of complex multilayer and HDI boards, as well as BGA-based designs.
PCB design for power electronics and high-current applications.
Creating component footprints and developing and maintaining libraries.
Knowledge of Design for Manufacturability (DFM) and Design for Assembly (DFA).
Understanding of signal integrity (SI) and power integrity (PI).
Understanding of power converter topologies and their electrical characteristics.